Description: ASMPT, a global leader in semiconductor solutions, shapes our digital world with innovations from smartphones to EVs. As it turns 50 in 2025, ASMPT’s comprehensive portfolio and commitment to cutting-edge technology drive a sustainable future for all.
In our increasingly interconnected world, the devices we use daily – from smartphones to electric vehicles – rely on sophisticated semiconductor and electronics manufacturing processes. As a global leader in semiconductor and electronics manufacturing solutions, ASMPT’s innovations touch nearly every aspect of modern life.
“If you are using any electronic device or drive a modern car, you’re likely using something built with our machines,” says Robin Ng, CEO of ASMPT, this statement underscoring the company’s understated yet pervasive influence in the tech landscape.
Founded 50 years ago, ASMPT has evolved into a technological powerhouse uniquely positioned with a comprehensive portfolio spanning the entire semiconductor and electronics manufacturing process. From chip packaging to final product assembly, ASMPT’s solutions are integral to creating the devices that define our digital age, shaping the future of technology across diverse industries.
ASMPT’s unique position in the market stems from its comprehensive portfolio of solutions that span two crucial phases of the electronics supply chain: chip packaging, and placement of packaged chips onto circuit boards. This broad-based portfolio allows ASMPT to address the entire spectrum of semiconductor and electronics manufacturing, from chip packaging to final product assembly.
The company’s commitment to innovation is evident in its cutting-edge technologies that push the boundaries of what’s possible. For example, these include its market leadership in Thermo-Compression Bonding (TCB), its advancements in Hybrid Bonding (HB) and its Photonics solutions that are meeting the skyrocketing demands of AI and data centres. In addition, their SIPLACE CA hybrid placement systems are revolutionizing advanced packaging applications like System-in-Package (SiP) and heterogeneous integration, with a seamless hybrid blend of semiconductor manufacturing and SMT capabilities.
But ASMPT’s vision extends beyond technological prowess. The company is deeply committed to sustainability and responsible business practices, as evidenced by its ambitious “Net Zero 2035” goal that aims to reduce Scope 1 and 2 emissions to net-zero by 2035. The company has set interim targets of reducing these emissions by 30% by 2026 and 50% by 2030. ASMPT is also taking a leadership role in industry-wide sustainability efforts as a founding member of the Semiconductor Climate Consortium (SCC), leading the Scope 2 Emissions Working Group.
ASMPT’s sustainability efforts extend to its workforce as well. The company is evolving its Diversity, Equity & Inclusion (DEI) framework, implementing initiatives such as Country Women’s Chapters and addressing unconscious biases. These efforts have earned ASMPT recognition as an “Employer of the Future” in [year] by the German Innovation Institute for Digitalisation and Sustainability.
As we stand on the cusp of transformative technologies like AI, 5G, and smart factories, ASMPT is poised to play a pivotal role. By seamlessly blending cutting-edge innovation with a strong commitment to sustainability, ASMPT is not just enabling the digital world – it’s shaping a brighter, more sustainable future for all.
In an era where technology and sustainability must go hand in hand, ASMPT is quietly revolutionizing the way we live, work, and interact with the world around us, enabling the digital world while shaping a bright and sustainable future for all.
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